Thursday, 24 October 2019

Samsung unveils 12GB RAM plus UFS 3.0 storage combo packages for mid-rangers

Samsung unveiled its latest "Multi-Chip Package" - uMCP - which combine 12GB of LPDDR4X RAM with fast UFS 3.0 storage. These are based on the latest 24-gigabit RAM chips manufactured on a 1y process (1y is the second enhancement of Samsung's 10nm-class process). In March this year Samsung produced the first 12GB RAM modules, but those used smaller capacity 16-gigabit chips (six of them). This new package contains only four 24-gigabit chips instead. Samsung is targeting the mid-range market with these and offers an alternative package with 10GB of RAM (combining two 24-gigabit and...

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